The ICT-Xp45-W-series is cost-efficient, electrically non-insulating and enriched with a high-heat conductive filler, solvent-and silicone-free high-performance phase change material.
The product group comprises three thickness units in total: 0,10mm, 0,20mm, 0,30mm All three products differ only by layer thickness.
Alternative replacement of thermally conductive paste - assure uniformity during assembly and increase durability of semiconductors by long-term material stability - no solvents and silicone evaporate, also suitable for applications in medical technology and optics. It is also an alternative to TIM applied to bases directly by the manufacturers - the advantage of variability, better transport and handling with modules, and there is no need to solve the expiration time of the modules prepared with TIM at the base. Only to watch storing temperature.
Informations de base :
|Marquage fabricant||Xp45-W-295-210mm-L |
|Type de composant:||!_fillers_! |
Matériel, couleur, design :
|Type de matériel:||!_conductive_! |
|Matériel: Boîtier||!_non-silicone_! |
|Couleur||GY - gris 40 % |
Paramètres thermiques et mécaniques:
|Tmin (température minimale de travail)||-40 [°C] |
|Tmax (température maximale de service)||140 [°C] |
|Thermal conductivity||3.5 W/m*K |
|Rth Thermal Impedance||0.03 K-in2/W |
|W - Largeur ||210 [mm] |
|L - Longueur ||295 [mm] |
|T - épaisseur||0.1 [mm] |
|PIN dimensions||0.00 [mm] |
Emballage et poids :
|Poids:||60 [g] |
Alternatives et remplacements
|Alternative 1:||I+W300x600-IP50-F05-AL2 |