• SiC Power MOSFET - High speed switching, - Low RDS(on), - Ultra low loss
• SiC Schottky Diode, - Zero reverse recovery, - Zero forward recovery, - Temperature Independent switching behavior, - Positive temperature coefficient on VF
• Very low stray inductance
• Internal thermistor for temperature monitoring
• High level of integration
• AlN substrate for improved thermal performance
Informations de base :
Marquage fabricant | MSCSM120AM50CT1AG |
Type de composant: | SiC MOSFET Tranzistor |
Kategorie | Full SiC (MOS-BD+D) |
Configuration: | Half Bridge 1*(Phase Leg) |
Spécifications: | SiC N-Channel MOSFET |
Construction: | 2*FET-BD+2*D |
Type de cas: | Modul |
Cas [inch] : | SP1F |
Type de matériel: | SiC Full |
RoHS | Oui |
REACH | Non |
NOVINKA | A |
RoHS1 | Ano |
Emballage et poids :
Unité: | pcs |
Poids: | 96 [g] |
Type d’emballage: | TUBE |
Petit paquet (nombre d'unités): | 1 |
Paramètres électro-physiques:
Udc (URRM, UCEO, Umax) | 1200 [V] |
Idc max (Tc/Ta=80÷89°C) | 44 [A] |
Uisol (@25°C/1min/50Hz) | 4000 [V] |
UF (maximum forward voltage) | 1.8 [VDC] |
Pd -s chladičem (Tc=25°C) | 245 [W] |
Input Logic Level (Ugs level) | 20V |
trr recovery time (If=Inom.,@25°C) | 31 [ns] |
tr (Turn-on / rise time) | 30 [ns] |
tf (turn-off=fall time) | 25 [ns] |
Qg (Total Gate Charge) | 137 [nC] |
Cin/CL Load Capacitance | 1990 pF |
Paramètres thermiques et mécaniques:
Dimensions (L*W*H) [mm]: | 52x43x12 |
Tmin (température minimale de travail) | -40 [°C] |
Tmax (température maximale de service) | 150 [°C] |
Rthjc1 IGBT | 0.61 [°C/W] |
Rthjc2 Dioda, Tyristor | 1.55 [°C/W] |
RM - Pitch pins | 3.8 [mm] |
RM1 - Espacement de lignes | 38 [mm] |
L - Longueur | 51.6 [mm] |
W - Largeur | 42.5 [mm] |
H - Hauteur | 12 [mm] |
PIN dimensions | 1,4 [mm] |
Lv - Length of outlets | 5.8 [mm] |